ASM Solder Paste Paste Accessories Ball Desoldering

Features:

brand new high quality Made of high-quality materials for durability This NC-559-ASM solder paste is used for BGA/CSP balls, semiconductor packaging, repair. This product is a no-clean solder paste with very little and does not require washing. The is colorless and transparent in appearance. Excellent printing performance, suitable for handprint and machine printing. Suitable for BGA balls, semiconductor packaging, repair. Computer motherboard north-south bridge, communication, graphics card, etc. for BGA is applicable. Just apply a at time. It is the best for BGA and CSP repair helper on the market. When the bumps of the for BGA chip are coated with flux paste and the PCB pads need to be coated. Good for BGA flux paste and machine will greatly improve the success rate regardless of manual soldering.

Product parameters: Model: NC-559-ASM Color: as pictured Capacity: 10CC

Package Included: 1 * NC-559-ASM Solder Paste

Note:

1.The real color of the item may be slightly different from the pictures shown on website caused by many factors such as brightness of your monitor and light brightness. 2.Please allow slight manual measurement deviation for the data.